Vibration suppression mechanism for an electronic device

ABSTRACT

Provided is a vibration suppression mechanism for an electronic device, which efficiently absorbs vibrations that adversely affect operation of the electronic device. The vibration suppression mechanism for the electronic device includes a holding unit that is constructed such that a vibration absorbing member is used at a contacting portion on a first surface of a holding member and a contact member protruding from a second surface of the holding member which is opposite to the first surface is held by the vibration absorbing member, the holding unit supporting the electronic device via the vibration absorbing member used at the contacting portion on the first surface or the contact member protruding from the second surface, and a housing for holding the holding unit in a mounted state under a state in which the contact member protruding from the second surface or the vibration absorbing member used at the contacting portion on the first surface abuts against a holding structure.

The present application is a continuation application of U.S. patentapplication Ser. No. 14/229,099 filed on Mar. 28, 2014, which claims thebenefit of priority from Japanese patent application No. 2013-079740,filed on Apr. 5, 2013, the disclosure of which is incorporated in itsentirety by reference herein.

BACKGROUND OF THE INVENTION 1. Field of the Invention

This invention relates to an information processing system in which anelectronic device is removably connected, and more particularly, to astructure for suppressing vibrations which affect operation of anelectronic device.

2. Description of the Related Art

In an information processing apparatus, structure design using amountable/removable electronic device is often made.

In this structure design, not only the mountability/removability of theelectronic device but also various other design factors are considered.Many factors including electrical connection, integration scale,cooling, vibrations, energy efficiency, and specifications arecomprehensively considered.

In many information processing apparatuses, as a shock absorbingstructure for reducing shock and vibrations to an electronic device, arubber (elastomer), sponge, or gel material is used as a shock absorbingmember between the electronic device and a housing.

Japanese Unexamined Patent Application Publication (JP-A) No. 2009-70530and Japanese Utility Model Registration No. 3130774 describe exemplarystructures in which a rubber (elastomer), sponge, or gel material isused as a damper.

Japanese Unexamined Patent Application Publication (JP-A) No. 2009-70530is a document which describes a structure for a hard disk drive (HDD) tobe integrated into in-vehicle electronic equipment. Japanese UtilityModel Registration No. 3130774 is a document which describes a structurefor an HDD to be integrated into a personal computer. These documentsdisclose insertion/extraction structures which suppress vibrations(shock) to an electronic device from the outside.

By the way, excellent vibration absorbing members to be used forsuppressing vibrations to an electronic device and vibrations from anelectronic device have been developed. Such vibration absorbing membersabsorb and suppress vibrations by converting vibrational energy intothermal energy or the like. Further, such vibration absorbing membersalso have the conventional function of suppressing transmission ofoscillatory waves. The energy conversion is realized using frictionbetween elements in the member or the like. Such vibration absorbingmembers are commercialized by, for example, E-A-R Specialty Composites.

An information processing apparatus may have effective shock absorbingeffects by adopting the structure disclosed in Japanese UnexaminedPatent Application Publication (JP-A) No. 2009-70530 or Japanese UtilityModel Registration No. 3130774. On the other hand, it is necessary toimprove the effect of suppressing vibrations which affect operation ofthe electronic device. For example, in the structures disclosed inJapanese Unexamined Patent Application Publication (JP-A) No. 2009-70530and Japanese Utility Model Registration No. 3130774, vibrational energyconsumed by the vibration absorbing member is not efficiently taken inthe vibration absorbing member. Therefore, an electronic device whichvibrates itself such as an HDD or an optical disc drive (ODD) may faildue to vibrations which itself causes. Further, there still is room forimprovement in that the amount of a material of the shock absorbingstructure used in a holding member for the electronic device is large.

A better vibration suppression structure for an electronic device whichcomprehensively considers the above is desired.

SUMMARY OF THE INVENTION

An object of this invention is to provide a vibration suppressionstructure for reducing vibrations which affect operation of anelectronic device to be used in an information processing system inwhich the electronic device is removably connected.

According to one embodiment of this invention, there is provided avibration suppression mechanism for an electronic device, the vibrationsuppression mechanism including: a holding unit that is constructed suchthat a vibration absorbing member is used at a contacting portion on afirst surface of a holding member for supporting the electronic device,and a contact member protruding from a second surface of the holdingmember which is opposite to the first surface is held by the vibrationabsorbing member; and a housing for holding the holding unit in amounted state under a state in which one of the vibration absorbingmember used at the contacting portion on the first surface and thecontact member protruding from the second surface abuts against aholding structure.

According to one embodiment of this invention, there is provided aholding unit for an electronic device, the holding unit including: aholding member having, on a first surface thereof, a contacting portionusing a vibration absorbing member; and a contact member held by thevibration absorbing member in a state of protruding from a secondsurface of the holding member which is opposite to the first surface.

According to one embodiment of this invention, there is provided aholding member of a holding unit for an electronic device, the holdingmember including: a rail to be a slid mechanism in relation to a guidein a rack housing; a vibration absorbing member provided at a contactingportion for supporting the electronic device; and a contact member thatis held by the vibration absorbing member and protrudes from a surfaceof the vibration absorbing member that is opposite to the contactingportion to be brought into contact with the guide in the rack housing.

According to one embodiment of this invention, it is possible to providethe vibration suppression structure for reducing vibrations which affectthe operation of the electronic device used in the informationprocessing system in which the electronic device is removably connected.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating an exemplary vibrationsuppression mechanism for an electronic device according to a firstembodiment of this invention.

FIG. 2 is a schematic view illustrating a rear surface of a holding unitfor the electronic device illustrated in FIG. 1.

FIG. 3 is a schematic view illustrating a side surface of the holdingunit for the electronic device illustrated in FIG. 1.

FIG. 4 is an enlarged schematic view illustrating a structure in sectionof a vibration suppression mechanism portion according to the firstembodiment.

FIG. 5 is an enlarged schematic view illustrating another structure insection of the vibration suppression mechanism portion.

FIG. 6 is an enlarged schematic view illustrating still anotherstructure in section of the vibration suppression mechanism portion.

FIG. 7 is an enlarged schematic view illustrating yet another structurein section of the vibration suppression mechanism portion.

FIG. 8 is an enlarged schematic view illustrating a further structure insection of the vibration suppression mechanism portion.

FIG. 9A is a schematic view illustrating a variation of the structure insection of the vibration suppression mechanism portion illustrated inFIG. 8.

FIG. 9B is a schematic view illustrating another variation of thestructure in section of the vibration suppression mechanism portionillustrated in FIG. 8.

FIG. 9C is a schematic view illustrating still another variation of thestructure in section of the vibration suppression mechanism portionillustrated in FIG. 8.

FIG. 9D is a schematic view illustrating yet another variation of thestructure in section of the vibration suppression mechanism portionillustrated in FIG. 8.

FIG. 10 is a schematic view illustrating an exemplary vibrationsuppression mechanism for an electronic device according to a secondembodiment of this invention.

FIG. 11 is a schematic view illustrating an exemplary vibrationsuppression mechanism for an electronic device according to a thirdembodiment of this invention.

FIG. 12 is a schematic view illustrating a vibration suppressionmechanism for an HDD according to an example of this invention.

FIG. 13 is a perspective view illustrating shapes of members forming thevibration suppression mechanism according to the example.

FIG. 14 is a sectional view illustrating a vibration suppressionmechanism portion according to the example.

FIGS. 15A and 15B are graphs showing the result of analysis of vibrationabsorbing action of a contact structure in a vibration absorbingstructure according to the example.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of this invention are described with reference to FIG. 1 toFIG. 11.

FIG. 1 to FIG. 4 are schematic views illustrating a vibrationsuppression mechanism for an electronic device 100 according to a firstembodiment of this invention. FIG. 1, FIG. 2, and FIG. 3 are schematicviews of the vibration suppression mechanism under a state of supportingthe electronic device 100 on a first surface side thereof and being heldin contact with a holding structure 200 on a second surface sidethereof. FIG. 4 is an enlarged schematic view illustrating a structurein section of a portion in which a holding unit 10 is held in contactwith the electronic device 100 and the holding structure 200.

As illustrated in FIG. 1, the vibration suppression mechanism for theelectronic device is substantially broken down into an electronicequipment housing 20 and the holding unit 10 removably connected to thehousing 20.

The holding unit 10 includes a holding member 11 for supporting theelectronic device 100. In this embodiment, only a bottom surface of theelectronic device 100 is supported. However, as described in otherembodiments described below, two or more surfaces may be supported.

Vibration absorbing members 12 are arranged on a portion of the holdingmember 11 held in contact with the electronic device 100 (first surfaceside of the holding member 11, i.e., top surface in FIG. 1). It isdesired that the electronic device 100 be fixed to the holding member 11using a screw, a double-faced tape, or the like. On the other hand, theelectronic device 100 may be fixed to the holding member 11 bystructurally fitting the electronic device 100 into the holding member11 (holding unit 10). Also in this case, in the holding member 11, thevibration absorbing members 12 are arranged between the electronicdevice 100 and the housing 20. Note that, there may be a portion otherthan the vibration absorbing members 12 at which the holding member 11and the electronic device 100 are held in contact with each other. Forexample, a member for antistatic purposes or for antishock purposes maybe included.

Further, as illustrated in FIG. 2, contact members 13 protrude on asecond surface side (top surface in FIG. 2) of the holding member 11.The contact members 13 are members which are brought into contact withthe holding structure 200 provided on the housing 20 side when theholding unit 10 which supports the electronic device 100 is held in thehousing 20. The contact members 13 are held by the vibration absorbingmembers 12, and are held by the holding member 11 via the vibrationabsorbing members 12. Usage of a low-friction material for the contactmembers 13 facilitates mounting/removal in relation to the electronicdevice 100 and the holding structure 200.

The housing 20 of the electronic equipment includes the holdingstructure 200 as a structure for holding the holding unit 10. Asdescribed above, the holding structure 200 is brought into contact withthe contact members 13 included in the holding unit 10 when the holdingunit 10 which supports the electronic device 100 is held in the housing20.

As necessary, the holding structure 200 may be structured as a guidemember for assisting the mounting/removal of the holding unit 10(holding member 11).

FIG. 3 is a schematic view illustrating a side surface side of theholding unit 10 illustrated in FIG. 1. FIG. 3 emphatically illustratesscale of the structure of portions which suppress vibrations. Further,portions surrounded by the broken lines in FIG. 3 correspond to aschematic view illustrating a structure in section of FIG. 4. Note that,a connector 14 illustrated in FIG. 3 is a connector for electricalcontact of the electronic device 100, and may be connected to the mainbody of the electronic equipment appropriately as the applicationrequires. Further, a bezel 15 of the holding unit 10 may beappropriately provided depending on the application and the outerappearance of the electronic equipment.

As illustrated in the structure in section of FIG. 4, the holding unit10 has, on the first surface side of the holding member 11, contactingportions with the vibration absorbing members 12. Further, the holdingunit 10 has, on the second surface side, contacting portions with thecontact members 13.

Further, the holding unit 10, in a state of being mounted to the housing20, abuts against the electronic device 100 via the first surface andabuts against the holding structure 200 via the second surface. Further,the vibration absorbing members 12 and the contact members 13 aresandwiched between the electronic device 100 and the holding structure200.

The holding member 11 holds the contact members 13 through the vibrationabsorbing members 12 in a protruding manner. Each of the contact members13 includes a protruding portion held in contact with the holdingstructure 200 and a portion which supports the protruding portion. Thesupporting portions are held by the vibration absorbing members 12.

FIG. 5 is a schematic view illustrating another structure in section toreplace the structure in section illustrated in FIG. 4. Note that, theelectronic device 100 is provided on the first surface side. Theelectronic device 100 may be provided on the second surface side. Thesame can be said with regard to other structures in section to bedescribed below.

As described above, the holding member 11 holds the contact members 13through the vibration absorbing members 12 in a protruding manner.

Each of the contact members 13 includes a protruding portion held incontact with the holding structure 200 and a portion which supports theprotruding portion. It is desired that a base portion be provided to theportion of each of the contact members 13 which is embedded in thevibration absorbing member 12 as illustrated in FIG. 5.

The base portion of the contact member 13 not only prevents the contactmember 13 from coming out of the vibration absorbing member 12 but alsohas the effect of assisting the vibration absorbing member 12 inabsorbing vibrations (absorbing energy). Further, change in thestructure of the base portion may enable more absorption of certainoscillatory waves. The effect of absorbing and reducing certainoscillatory waves may be confirmed by comparing some actualmeasurements.

It is desired that only the vibration absorbing member 12 be interposedbetween the base portion of the contact member 13 and (the shell of) theelectronic device 100 as illustrated in FIG. 5.

In other words, it is desired that the contact member 13 be mounted tothe holding member 11 so that the base portion thereof be covered withthe vibration absorbing member 12 and the protruding portion thereofexists.

Note that, the protruding portion and the base portion of the contactmember 13 may be integrally formed, or may be formed by bonding oradhering different parts.

FIG. 6 is a schematic view illustrating still another structure insection to replace the structure in section illustrated in FIG. 4.

With reference to FIG. 6, in the holding member 11, molded portionswhich are integral with the holding member 11 (structure of the holdingmember 11 in FIG. 6) are provided on both sides of the base portion ofthe contact member 13 so as to be flush therewith in FIG. 6. The moldedportions have a positional relationship of being arranged atsubstantially equivalent distances from the shell of the electronicdevice 100.

The molded portions not only serve as cores but also assist in absorbingvibrations. Further, it is preferred that the molded portions are in theshape of a prism. Alternatively, the molded portions may be in the shapeof a cylinder. The distance (interval) between the molded portionsprovided on both sides of the contact member 13 may be adjusted to beused for changing (dispersing, sliding, or the like) the resonancefrequency (resonance point) of the holding member 11.

FIG. 7 is a schematic view illustrating yet another structure in sectionto replace the structure in section illustrated in FIG. 4.

With reference to FIG. 7, similarly to the structure illustrated in FIG.6, in the holding member 11, molded portions which are integral with theholding member 11 are provided on both sides of the base portion of thecontact member 13 so as to be flush therewith in FIG. 6. In addition,the holding member 11 has a cavity which is larger than the diameter ofa contacting portion of the contact member 13 at a contacting portionbetween the vibration absorbing member 12 and the base portion of thecontact member 13. The cavity may be equivalent to the diameter of thecontacting portion.

The diameter of the cavity and the material of the vibration absorbingmember 12 may be adjusted to be used for changing (dispersing, sliding,or the like) the resonance frequency (resonance point) of the holdingmember 11.

FIG. 8 is a schematic view illustrating a further structure in sectionto replace the structure in section illustrated in FIG. 4.

In this holding unit 10, the electronic device 100 is screwed into theholding member 11 using a screw 16. FIG. 9A to FIG. 9D illustratevariations of the structure illustrated in FIG. 8.

With reference to FIG. 8, in the holding member 11, the contact member13 and the screw 16 are provided on both sides, respectively, of themolded portion which is integral with the surrounding holding member 11.The screw 16 is screwed into a receiving structure (female thread)provided in the shell of the electronic device 100 to screw the holdingmember 11 and the electronic device 100 together.

With reference to FIG. 9A, in the holding member 11, the molded portionwhich is integral with the surrounding holding member 11 and a spacermember 17 are provided so as to be flush with the base portion of thecontact member 13. The molded portion and the spacer member 17 have apositional relationship of being arranged at substantially equivalentdistances from the shell of the electronic device 100.

The spacer member 17 is a member which receives the screw 16 to bescrewed into the electronic device 100, and is held by the holdingmember 11 via the vibration absorbing member 12. The positionalrelationship between the spacer member 17 and the contact member 13causes the vibration absorbing member 12 to work effectively.

Further, the spacer member 17 may be in a shape which is directly heldin contact with the electronic device 100, as illustrated in FIG. 9B.The shape may be used for changing (dispersing, sliding, or the like)the resonance frequency (resonance point) of the holding member 11.

Further, the spacer member 17 may be in an oval shape as illustrated inFIG. 9C. The shape may be used for changing (dispersing, sliding, or thelike) the resonance frequency (resonance point) of the holding member 11and enhancing the effect of absorbing vibrations.

Further, in the vibration absorbing member 12, as illustrated in FIG.9D, a cavity which is larger than the diameter of the contacting portionof the contact member 13 may be provided at the contacting portionbetween the vibration absorbing member 12 and the base portion of thecontact member 13. The diameter of the cavity, the material of thevibration absorbing members 12, the positional relationship with thespacer member 17, and the like may be adjusted to be used for changing(dispersing, sliding, or the like) the resonance frequency (resonancepoint) of the holding member 11.

By forming the holding unit 10 in this way, a vibration suppressionmechanism which causes the vibration absorbing members 12 incorporatedinto the holding member 11 to absorb more easily vibrations thatadversely affect operation of the electronic device 100 may be formed.Further, by changing the shapes of and positional relationship betweenmembers which form the holding member 11, resonance vibrations at acertain frequency may be absorbed and reduced, and the resonance pointmay be moved.

These effects are obtained by giving the above-mentioned structure tothe holding unit 10 which is interposed between the electronic device100 and the housing member of the electronic equipment (namely, holdingstructure 200). This function is brought about by using the vibrationabsorbing members 12 at contacting portions on the first surface side,by protruding the contact members 13 from the second surface oppositethereto of the holding member 11 for supporting the electronic device100, and by contacting both the surfaces with the electronic device 100and the holding structure 200, respectively. In other words, by adoptingthe above-mentioned structure, vibrations which become a problem relatedto operation of the electronic device 100 may be effectively absorbed bythe vibration absorbing members 12.

Note that, the internal structure on the housing 20 side (structure ofthe holding structure 200) of the electronic equipment is notspecifically limited insofar as a typical structure which enablesmounting/removal is possible is adopted and the contacting portion ofthe vibration absorbing member 12 or the contact member 13 may abutagainst the structure in the mounted state.

Next, a second embodiment of this invention is described. Note that,description of portions similar to those in the first embodiment is madeonly in brief or omitted.

FIG. 10 is a schematic view illustrating a vibration suppressionmechanism for the electronic device 100 according to the secondembodiment.

As illustrated in FIG. 10, the vibration suppression mechanism for theelectronic device 100 is substantially broken down into the electronicequipment housing 20 and the holding unit 10 removably connected to thehousing 20. A plurality of holding units 10 may be insertedinto/extracted from the electronic equipment housing 20.

The holding unit 10 is U-shaped and includes a pair of holding members11 for supporting the electronic device 100. In this embodiment, twosurfaces, i.e., right and left surfaces, of the electronic device 100are configured to be supported.

The holding member 11 has contacting portions with the electronic device100 on the side of the first surface (inside of the holding member 11)at which the vibration absorbing members 12 are arranged. Further, theholding member 11 is structured so as to have contacting portions withthe holding structure 200 on the side of the second surface (outside ofthe holding member 11) from which the contact members 13 protrude. Thecontact members 13 are held by the vibration absorbing members 12, andare held by the holding member 11 via the vibration absorbing members12. Usage of a low-friction material for the contact members 13facilitates mounting/removal in relation to the holding structure 200.

The housing 20 of the electronic equipment includes the holdingstructure 200 as a structure for holding the holding unit 10. Asdescribed above, the holding structure 200 is brought into contact withthe contact members 13 included in the holding unit 10 when the holdingunit 10 which supports the electronic device 100 is held in the housing20. Each of the vibration absorbing members 12 may adopt the structuresin section described in the first embodiment. Note that, the vibrationabsorbing members 12 are not necessarily required to adopt the samestructure in section, and may adopt different structures in sectiondepending on, for example, the source of vibrations of the electronicdevice.

By forming the holding unit 10 in this way, the action and effectsdescribed in the first embodiment are obtained. Further, by holding aplurality of surfaces of the electronic device, various vibrationsuppression structures may be formed. In addition, oscillatory waves(vibrations from the outside) which are caused by electronic devices 100arranged side by side in proximity to one another may be suppressed.Further, self-caused oscillatory waves (emission vibrations) may besuppressed.

Further, in the above description of the first and second embodiments,structures of the holding unit 10 which support one or two surfaces ofthe electronic device 100 are described. However, this invention is notlimited thereto, and a structure which supports three surfaces of theelectronic device 100 is included therein. Further, structures whichsupport four, five, or six surfaces of the electronic device 100 mayalso be used.

Next, a third embodiment of this invention is described. Note that,description of portions similar to those in the first and secondembodiments is made only in brief or omitted.

As in the structure in section illustrated in FIG. 11, the holding unit10 has a contacting portion which is the vibration absorbing member 12on the first surface side of the holding member 11. Further, the holdingunit 10 has a contacting portion which is the contact member 13 on thesecond surface side of the holding member 11.

Further, as illustrated in FIG. 11, the structure held in abutmentagainst the electronic device 100 and the structure held in abutmentagainst the holding structure 200 (structures on the first surface sideand on the second surface side) are interchangeable. Further, thevibration absorbing members 12 are not necessarily required to have thestructures on the first surface side and the structures on the secondsurface side which are flush with one another, respectively, and mayadopt surface structures which are different from one another.

In other words, the holding unit 10 is held in abutment against theelectronic device 100 and the holding structure 200 via the firstsurface and the second surface in a state of being mounted to thehousing 20, and the vibration absorbing member 12 and the contact member13 are sandwiched between the electronic device 100 and the holdingstructure 200.

The holding member 11 holds the contact member 13 through the vibrationabsorbing member 12 in a protruding manner. The contact member 13 isheld by the vibration absorbing member 12 and held in contact with theelectronic device 100 or the holding structure 200.

By forming the holding unit 10 in this way, the action and effectsdescribed in the first and second embodiments are obtained. Further,design flexibility is obtained with regard to the structure of theholding unit 10.

Next, an example of this invention is described.

This example is a vibration suppression mechanism relating to an HDDholding unit for an aggregate server.

FIG. 12 exemplifies a vibration suppression mechanism of an HDD (HardDisk Drive). In this example, as in many servers, the adopted structureincludes a pair of guides provided in a blade housing for a rack server(holding housing 200) and the holding member 11 of the HDD holding unitwhich is a pair of rails, which are used to enable mounting/removal ofan HDD unit (HDD and HDD holding unit) by sliding the HDD unit.

The HDD holding unit uses the holding member 11 for supporting the HDDas rail members, and uses the vibration absorbing members 12 atcontacting portions between the HDD and the rail members (first surfaceside).

Further, the HDD holding unit covers, with the vibration absorbingmembers 12, the contact members 13 which protrude from the secondsurface of the holding member 11.

The contact members 13 are brought into contact with the guides onsurfaces, respectively, under a state in which the HDD unit is mounted.

A docking connector for establishing electrical connection is providedon a rear surface of the HDD unit.

With regard to the structure of the blade housing, similarly to aconventional structure, a pair of guides formed of a metal or a resin isprovided in a holding unit insertion slot, and a docking connector forestablishing electrical connection with the HDD unit is provided.

As necessary, an access lamp for indicating the operating state of theHDD, and a lever or a button for mounting/removal may be provided at thebezel 15 of the HDD holding unit.

Note that, in this example, an HDD rack such as a data center or aserver room which enables hot swap during operation is described, but astructure for mounting/removing the electronic device 100 such as anODD, a solid state drive (SDD), a battery, a blade itself, or the likemay be similarly formed.

Further, in this example, transversely mounted blades are illustrated,but longitudinally mounted blades may be similarly formed.

Next, exemplary shapes of members forming the vibration absorbing member12 are described.

FIG. 13 is a perspective view illustrating shapes of members forming thevibration absorbing member illustrated in FIG. 12. FIG. 14 is asectional view illustrating the assembled members illustrated in FIG.13.

The perspective view of FIG. 13 illustrates (a) the structure of theholding member 11 (only in the vibration absorbing member 12), (b) thevibration absorbing member 12, (c) the contact member 13, (d) the spacermember 17, and (e) the screw 16. These members are assembled asillustrated in FIG. 14.

A structure in section illustrated in FIG. 14 may be formed in any way.

For example, two vibration absorbing members 12 may be bonded to bothsurfaces, respectively, of a portion at which the holding member 11(rail members) is assembled so as to sandwich the contact member 13 andthe spacer member 17.

Further, two vibration absorbing members 12 may be bonded so as tosandwich the structure of the holding member 11 (core), and the contactmember 13 and the spacer member 17.

Further, a vibration absorbing material in a fluid state may be injectedinto a portion at which the holding member 11 is assembled so as toembed the structure of the holding member 11, and the contact member 13and the spacer member 17.

Further, in the holding member 11, the contact members 13 may besandwiched between the vibration absorbing members 12, and the twovibration absorbing members 12 which sandwich the contact members 13 maybe formed of different materials. Usage of such vibration absorbingmembers 12 which are different from each other may assist in moving theresonance frequency (resonance point) of the rail members.

Further, the holding member 11 may be formed by, after the contactmembers 13 are placed at predetermined positions, injecting andprocessing a plurality of vibration absorbing materials. Assignment of aplurality of vibration absorbing materials having different compositions(characteristics) to different portions of one vibration absorbingmember 12 may assist in moving the resonance frequency (resonance point)of the rail members.

FIGS. 15A and 15B show the result of measurement of vibrations to whichthe mounted HDD is subjected using the HDD holding unit having thevibration absorbing structure illustrated in FIG. 12 to FIG. 14 (seeFIG. 15B) and a similar HDD holding unit in which a contact is formedintegrally with the HDD unit (see FIG. 15A) (the sources of thevibrations is the HDD itself and other HDDs). With regard to the HDDholding unit for comparison, the contact is formed in the core of theholding member 11 and is protruded, and shapes of other portions aresubstantially equivalent.

As is clear from FIGS. 15A and 15B, a lot of oscillatory waves whosesources are thought to be carriages, spindle motors, and the like of thedevice itself and other devices are as a whole absorbed moreeffectively. Further, it is confirmed that, by the structure of theexample, peak values such as a peak 1 and a peak 2 shown in FIGS. 15 areeffectively reduced and a peak region such as a peak 3 is disappeared.

As described above, according to the vibration suppression structure ofthis invention, vibrations which affect operation of an electronicdevice used in an information processing system in which the electronicdevice is removably connected may be reduced.

Further, a solving method which suppresses vibrations to an electronicdevice, vibrations from other electronic devices, and vibrations toother electronic devices used in design analysis considering many-sidedinfluence may be provided. Therefore, by changing the structure of theholding unit (holding member), the chronic problem of vibrations may besolved or alleviated.

Further, as described in the example, this invention may be easilyapplied to existing specifications of a housing structure, and may berealized in shapes according to specifications of an existing serverrack, storage rack, or the like. Therefore, the problem of vibrationsmay be solved without changing operating conditions other thanvibrations (electrical connection, integration scale, cooling, energyefficiency, specifications, and the like). For example, even if, as theHDD grows in capacity, oscillatory waves caused by a carriage, a spindlemotor, and the like newly become a problem in reading/writing, theproblem may be solved by reducing or moving oscillatory waves of acertain frequency band.

Note that, the specific structure of this invention is not limited tothe embodiments described above, and modifications which fall within thegist of this invention are also included in this invention. For example,in the description above, a structure in which the vibration suppressionstructure has only one contact is described, but the vibration absorbingmember may have a plurality of contact members. Further, the structureof the holding member for supporting the vibration absorbing memberwhich is described as the core and the spacer member may have a surfaceunevenness. Such modifications also fall within the scope of thisinvention.

Further, part or whole of the above-mentioned embodiments can also bedescribed as follows. Note that, the following supplementary notes arenot intended to limit this invention.

[Supplementary Note 1]

A vibration suppression mechanism for an electronic device, thevibration suppression mechanism including:

a holding unit that is constructed such that a vibration absorbingmember is used at a contacting portion on a first surface of a holdingmember, and a contact member protruding from a second surface of theholding member which is opposite to the first surface is held by thevibration absorbing member, the holding unit supporting the electronicdevice via one of the vibration absorbing member used at the contactingportion on the first surface and the contact member protruding from thesecond surface; and

a housing for holding the holding unit in a mounted state under a statein which one of the contact member protruding from the second surfaceand the vibration absorbing member used at the contacting portion on thefirst surface abuts against a holding structure.

[Supplementary Note 2]

A vibration suppression mechanism for an electronic device, thevibration suppression mechanism including:

a holding unit that is constructed such that, in a holding member forsupporting the electronic device, a vibration absorbing member is usedat a contacting portion between the electronic device and the holdingmember, and a contact member that protrudes from a surface of theholding member that is opposite to a surface that supports theelectronic device to be brought into contact with a holding structure isheld by the vibration absorbing member; and

a housing that includes the holding structure and holds the holding unitin a mounted state under a state in which the contact member abutsagainst the holding structure.

[Supplementary Note 3]

A vibration suppression mechanism for an electronic device, thevibration suppression mechanism including:

a holding unit that is constructed such that, in a holding member forsupporting an electronic device, a contact member that protrudes from asurface of the holding member to abut against the electronic device isheld by a vibration absorbing member, and a surface opposite to asurface that holds the electronic device is brought into contact with aholding structure via the vibration absorbing member; and

a housing that includes the holding structure and holds the holding unitin a mounted state under a state in which the vibration absorbing memberis held in contact with the holding structure.

[Supplementary Note 4]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which:

the contact member includes a contacting portion to be brought intocontact with one of the electronic device and the holding structure, anda base portion for supporting the contacting portion; and

the holding unit is constructed such that the vibration absorbing memberis interposed between the base portion and one of the electronic deviceand the holding structure, and the base portion is covered with thevibration absorbing member.

[Supplementary Note 5]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which the holdingunit is constructed such that the vibration absorbing member isinterposed between the base portion and one of the electronic device andthe holding structure, and the base portion is sandwiched by thevibration absorbing member.

[Supplementary Note 6]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which the holdingunit is constructed such that the vibration absorbing member isinterposed between the base portion and one of the electronic device andthe holding structure, and a cavity that is equivalent to or larger thana diameter of the contacting portion exists at a contacting portion ofthe vibration absorbing member with the base portion.

[Supplementary Note 7]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which the holdingunit is constructed such that the holding member holds, by the vibrationabsorbing member, a spacer member for receiving a screw to be screwedinto the electronic device.

[Supplementary Note 8]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which the holdingmember is constructed such that the spacer member held by the vibrationabsorbing member and the base portion of the contact member are arrangedto have a positional relationship of being arranged at equivalentdistances from a shell of the electronic device.

[Supplementary Note 9]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which theelectronic device is any one of an HDD, an ODD, an SSD, a battery, and ablade server.

[Supplementary Note 10]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which the housingis any one of a server rack, a notebook personal computer, a desktoppersonal computer, a mobile terminal, AV equipment, and mobile AVequipment.

[Supplementary Note 11]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which the housingis a server rack in which a plurality of the same kind of electronicdevices are to be mounted in parallel with one another.

[Supplementary Note 12]

A vibration suppression mechanism for an electronic device according toany one of the above-mentioned supplementary notes, in which:

the vibration absorbing member is made of a material that performsenergy conversion from vibrations to heat;

the holding member is constructed such that a contacting portion withthe electronic device is provided on the first surface thereof, acontacting portion with the holding structure is provided on the secondsurface thereof, and the holding member is used as a rail; and

the holding structure is constructed as a guide provided on the housingside.

[Supplementary Note 13]

A holding unit for an electronic device, the holding unit including:

a holding member having, on a first surface thereof, a contactingportion using a vibration absorbing member; and

a contact member held by the vibration absorbing member in a state ofprotruding from a second surface of the holding member which is oppositeto the first surface.

[Supplementary Note 14]

A holding unit for an electronic device, the holding unit including:

a holding member including a vibration absorbing member at a contactingportion for supporting the electronic device; and

a contact member that is held by the vibration absorbing member of theholding member and protrudes from a surface of the holding member thatis opposite to a surface that supports the electronic device to bebrought into contact with a holding structure of a housing.

[Supplementary Note 15]

A holding unit for an electronic device, the holding unit including:

a holding member including a vibration absorbing member at a contactingportion with a holding structure of a housing; and

a contact member that is held by the vibration absorbing member of theholding member and protrudes from a surface of the holding member thatis opposite to a surface that supports the electronic device to bebrought into contact with the electronic device.

[Supplementary Note 16]

A holding unit for an electronic device according to any one of theabove-mentioned supplementary notes, in which:

the contact member includes a contacting portion to be brought intocontact with one of the electronic device and the holding structure, anda base portion for supporting the contacting portion; and

the holding member is constructed such that the vibration absorbingmember is interposed between the base portion and one of the electronicdevice and the holding structure, and the base portion is covered withthe vibration absorbing member.

[Supplementary Note 17]

A holding unit for an electronic device according to any one of theabove-mentioned supplementary notes, in which the holding member isconstructed such that the vibration absorbing member is interposedbetween the base portion and one of the electronic device and theholding structure, and the base portion is sandwiched by the vibrationabsorbing member.

[Supplementary Note 18]

A holding unit for an electronic device according to any one of theabove-mentioned supplementary notes, in which the holding member isconstructed such that the vibration absorbing member is interposedbetween the base portion and one of the electronic device and theholding structure, and a cavity that is equivalent to or larger than adiameter of the contacting portion exists at a contacting portion of thevibration absorbing member with the base portion.

[Supplementary Note 19]

A holding unit for an electronic device according to any one of theabove-mentioned supplementary notes, in which the holding member isconstructed such that the vibration absorbing member holds a spacermember for receiving a screw to be screwed into the electronic device.

[Supplementary Note 20]

A holding unit for an electronic device according to any one of theabove-mentioned supplementary notes, in which the holding member isconstructed such that the spacer member held by the vibration absorbingmember and the base portion of the contact member are arranged to have apositional relationship of being arranged at equivalent distances from ashell of the electronic device.

[Supplementary Note 21]

A holding unit for an electronic device according to any one of theabove-mentioned supplementary notes, in which:

the electronic device is an HDD;

the housing is a server rack in which a plurality of the same kind ofelectronic devices are to be mounted in parallel with one another;

the vibration absorbing member is made of a material that performsenergy conversion from vibrations to heat;

the holding member is constructed such that a contacting portion withthe HDD is provided on the first surface thereof, a contacting portionwith the holding structure is provided on the second surface thereof,and the holding member is used as a rail and is placed at a contactingposition on a side surface of the HDD; and

the holding structure is constructed as a guide provided on the serverrack side.

[Supplementary Note 22]

A rail member, including:

a rail to be a slid mechanism in relation to a guide in a rack housing;

a vibration absorbing member provided at a contacting portion forsupporting an electronic device; and

a contact member that is held by the vibration absorbing member andprotrudes from a surface of the vibration absorbing member that isopposite to the contacting portion to be brought into contact with theguide in the rack housing.

[Supplementary Note 23]

A rail member according to any one of the above-mentioned supplementarynotes, in which the rail member is constructed to sandwich the contactmember with the vibration absorbing member, and one portion and anotherportion of the vibration absorbing member that sandwich the contactmember are made of different materials.

[Supplementary Note 24]

A rail member according to any one of the above-mentioned supplementarynotes, in which the rail member is formed by, after the contact memberis placed at a predetermined position, injecting and processing aplurality of kinds of vibration absorbing materials.

This invention may be applied to an information processing system inwhich an electronic device, such as a server rack, a notebook personalcomputer, a desktop personal computer, a mobile terminal, AV equipment,or mobile AV equipment, is removably connected.

Further, this invention may be applied to vibration suppression of notonly a discrete device such as an HDD, an ODD, an SSD, or a battery butalso a blade server or an HDD unit having a plurality of electronicdevices mounted thereon.

What is claimed is:
 1. A vibration suppression mechanism for anelectronic device (100), the vibration suppression mechanism comprising:a housing (20) and a holding unit (10) which is removably connected tothe housing (20) and which is configured to support the electronicdevice (100) ; the holding unit (10) comprising ;: a holding member (11)which has a first surface contacted with the electronic device (100) anda second surface which is opposite to the first surface and which isdirected towards the housing (20) ; a vibration absorbing member (12)arranged between the first surface of the holding member (11) and theelectronic device (100) ; and a contact member (13) protruding from thesecond surface of the holding member (11) to be contacted with thehousing (20) wherein, when the holding unit (10) is housed in thehousing (20), the contact member (13) is guided along and contacted withthe housing (20).
 2. A holding unit for an electronic device, theholding unit comprising: a holding member (11) which has a first surfacecontacted with an electronic device (100) and a second surface which isopposite to the first surface and which is directed towards a housing(20) ; a vibration absorbing member (12) provided on the first surfaceof the holding member (11); and a contact member (13) protruding fromthe second surface of the holding member (11) to be contacted with thehousing (20) wherein, when the holding unit (10) is housed in thehousing (20), the contact member (13) is guided along and contacted withthe housing (20).